JPH02858B2 - - Google Patents

Info

Publication number
JPH02858B2
JPH02858B2 JP5880380A JP5880380A JPH02858B2 JP H02858 B2 JPH02858 B2 JP H02858B2 JP 5880380 A JP5880380 A JP 5880380A JP 5880380 A JP5880380 A JP 5880380A JP H02858 B2 JPH02858 B2 JP H02858B2
Authority
JP
Japan
Prior art keywords
lead
brazing material
brazing
multilayer ceramic
ribbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5880380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56155559A (en
Inventor
Masahiro Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5880380A priority Critical patent/JPS56155559A/ja
Publication of JPS56155559A publication Critical patent/JPS56155559A/ja
Publication of JPH02858B2 publication Critical patent/JPH02858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5880380A 1980-05-02 1980-05-02 Manufacture of ceramic package Granted JPS56155559A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5880380A JPS56155559A (en) 1980-05-02 1980-05-02 Manufacture of ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5880380A JPS56155559A (en) 1980-05-02 1980-05-02 Manufacture of ceramic package

Publications (2)

Publication Number Publication Date
JPS56155559A JPS56155559A (en) 1981-12-01
JPH02858B2 true JPH02858B2 (en]) 1990-01-09

Family

ID=13094747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5880380A Granted JPS56155559A (en) 1980-05-02 1980-05-02 Manufacture of ceramic package

Country Status (1)

Country Link
JP (1) JPS56155559A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624463B (zh) * 2013-11-29 2016-03-23 中国电子科技集团公司第四十七研究所 Fp型陶瓷管壳平行缝焊封装夹具

Also Published As

Publication number Publication date
JPS56155559A (en) 1981-12-01

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